View in EDS HTML Full Text PDF Full Text

Simulation of semiconductor wafer dicing induced faults on chips and their application as augmentation method for a deep learning based visual inspection system.

Saved in:
Bibliographic Details
Title: Simulation of semiconductor wafer dicing induced faults on chips and their application as augmentation method for a deep learning based visual inspection system.
Authors: Friedrich, Michael1, michael.friedrich@cs.tu-chemnitz.de, Schlosser, Tobias1, tobias.schlosser@cs.tu-chemnitz.de, Kowerko, Danny1, danny.kowerko@cs.tu-chemnitz.de
Source: Journal of Intelligent Manufacturing; Feb2026, Vol. 37 Issue 2, p573-596, 24p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 191453172
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Simulation of semiconductor wafer dicing induced faults on chips and their application as augmentation method for a deep learning based visual inspection system.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Friedrich%2C+Michael%22">Friedrich, Michael</searchLink><relatesTo>1</relatesTo>, <i>michael.friedrich@cs.tu-chemnitz.de</i><br /><searchLink fieldCode="AU" term="%22Schlosser%2C+Tobias%22">Schlosser, Tobias</searchLink><relatesTo>1</relatesTo>, <i>tobias.schlosser@cs.tu-chemnitz.de</i><br /><searchLink fieldCode="AU" term="%22Kowerko%2C+Danny%22">Kowerko, Danny</searchLink><relatesTo>1</relatesTo>, <i>danny.kowerko@cs.tu-chemnitz.de</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Intelligent+Manufacturing%22">Journal of Intelligent Manufacturing</searchLink>; Feb2026, Vol. 37 Issue 2, p573-596, 24p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=191453172
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10845-024-02559-0
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 24
        StartPage: 573
    Titles:
      – TitleFull: Simulation of semiconductor wafer dicing induced faults on chips and their application as augmentation method for a deep learning based visual inspection system.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Friedrich, Michael
      – PersonEntity:
          Name:
            NameFull: Schlosser, Tobias
      – PersonEntity:
          Name:
            NameFull: Kowerko, Danny
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 02
              Text: Feb2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 09565515
          Numbering:
            – Type: volume
              Value: 37
            – Type: issue
              Value: 2
          Titles:
            – TitleFull: Journal of Intelligent Manufacturing
              Type: main
ResultId 1