APA (7th ed.) Citation

Liu, H., Takakuwa, M., Yamamoto, M., Wang, Y., Yokota, T., Someya, T., . . . Takamatsu, S. (2026). A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics. Advanced Science, 13(22), 1. https://doi.org/10.1002/advs.202518733

Chicago Style (17th ed.) Citation

Liu, Hao, Masahito Takakuwa, Michitaka Yamamoto, Yiwen Wang, Tomoyuki Yokota, Takao Someya, Toshihiro Itoh, and Seiichi Takamatsu. "A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics." Advanced Science 13, no. 22 (2026): 1. https://doi.org/10.1002/advs.202518733.

MLA (9th ed.) Citation

Liu, Hao, et al. "A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics." Advanced Science, vol. 13, no. 22, 2026, p. 1, https://doi.org/10.1002/advs.202518733.