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A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics.

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Title: A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics.
Authors: Liu, Hao1, Takakuwa, Masahito2,3, Yamamoto, Michitaka1, Wang, Yiwen1, Yokota, Tomoyuki2,3, Someya, Takao4, Itoh, Toshihiro1, Takamatsu, Seiichi4, stakamatsu@binghamton.edu
Source: Advanced Science; 4/17/2026, Vol. 13 Issue 22, p1-12, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193087253
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics.
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  Data: <searchLink fieldCode="JN" term="%22Advanced+Science%22">Advanced Science</searchLink>; 4/17/2026, Vol. 13 Issue 22, p1-12, 12p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=193087253
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        Value: 10.1002/advs.202518733
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        Text: English
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      – TitleFull: A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics.
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              Text: 4/17/2026
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              Y: 2026
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