APA (7th ed.) Citation

Kim, S., Cheng, Y., Li, T., White, N., Wang, X., Ringgold, K., . . . Chung, J. (2026). Non‐Invasive Multidimensional Capacitive Sensing for In Vivo Traumatic Brain Injury Monitoring. Advanced Materials Technologies, 11(9), 1. https://doi.org/10.1002/admt.202502415

Chicago Style (17th ed.) Citation

Kim, Shawn, Yu‐Jen Cheng, Tianyi Li, Nathan White, Xu Wang, Kristyn Ringgold, Lauren Neidig, Younghoon Kwon, and Jae‐Hyun Chung. "Non‐Invasive Multidimensional Capacitive Sensing for In Vivo Traumatic Brain Injury Monitoring." Advanced Materials Technologies 11, no. 9 (2026): 1. https://doi.org/10.1002/admt.202502415.

MLA (9th ed.) Citation

Kim, Shawn, et al. "Non‐Invasive Multidimensional Capacitive Sensing for In Vivo Traumatic Brain Injury Monitoring." Advanced Materials Technologies, vol. 11, no. 9, 2026, p. 1, https://doi.org/10.1002/admt.202502415.