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Non‐Invasive Multidimensional Capacitive Sensing for In Vivo Traumatic Brain Injury Monitoring.

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Title: Non‐Invasive Multidimensional Capacitive Sensing for In Vivo Traumatic Brain Injury Monitoring.
Authors: Kim, Shawn1, Cheng, Yu‐Jen1, Li, Tianyi1, White, Nathan2, Wang, Xu2, Ringgold, Kristyn2, Neidig, Lauren3, Kwon, Younghoon4, Chung, Jae‐Hyun1, jae71@uw.edu
Source: Advanced Materials Technologies; May2026, Vol. 11 Issue 9, p1-15, 15p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 193491295
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Non‐Invasive Multidimensional Capacitive Sensing for In Vivo Traumatic Brain Injury Monitoring.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=193491295
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      – Type: doi
        Value: 10.1002/admt.202502415
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      – Code: eng
        Text: English
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        PageCount: 15
        StartPage: 1
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      – TitleFull: Non‐Invasive Multidimensional Capacitive Sensing for In Vivo Traumatic Brain Injury Monitoring.
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            NameFull: Kim, Shawn
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            NameFull: Cheng, Yu‐Jen
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            NameFull: Li, Tianyi
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            NameFull: White, Nathan
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            NameFull: Wang, Xu
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            NameFull: Ringgold, Kristyn
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            – D: 01
              M: 05
              Text: May2026
              Type: published
              Y: 2026
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              Value: 11
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              Value: 9
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            – TitleFull: Advanced Materials Technologies
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