SmartBoost: Lightweight ML-Driven Boosting for Thermally-Constrained Many-Core Processors.
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| Title: | SmartBoost: Lightweight ML-Driven Boosting for Thermally-Constrained Many-Core Processors. |
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| Authors: | Rapp, Martin1, martin.rapp@kit.edu, Sikal, Mohammed Bakr1, bakr.sikal@kit.edu, Khdr, Heba1, heba.khdr@kit.edu, Henkel, Jörg1, henkel@kit.edu |
| Source: | DAC: Annual ACM/IEEE Design Automation Conference; 2021, Issue 58, p265-270, 6p |
| Database: | Applied Science & Technology Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 193960788 AccessLevel: 2 PubType: Conference PubTypeId: conference PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: SmartBoost: Lightweight ML-Driven Boosting for Thermally-Constrained Many-Core Processors. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Rapp%2C+Martin%22">Rapp, Martin</searchLink><relatesTo>1</relatesTo>, <i>martin.rapp@kit.edu</i><br /><searchLink fieldCode="AU" term="%22Sikal%2C+Mohammed+Bakr%22">Sikal, Mohammed Bakr</searchLink><relatesTo>1</relatesTo>, <i>bakr.sikal@kit.edu</i><br /><searchLink fieldCode="AU" term="%22Khdr%2C+Heba%22">Khdr, Heba</searchLink><relatesTo>1</relatesTo>, <i>heba.khdr@kit.edu</i><br /><searchLink fieldCode="AU" term="%22Henkel%2C+Jörg%22">Henkel, Jörg</searchLink><relatesTo>1</relatesTo>, <i>henkel@kit.edu</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22DAC%3A+Annual+ACM%2FIEEE+Design+Automation+Conference%22">DAC: Annual ACM/IEEE Design Automation Conference</searchLink>; 2021, Issue 58, p265-270, 6p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=193960788 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/DAC18074.2021.9586287 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 265 Titles: – TitleFull: SmartBoost: Lightweight ML-Driven Boosting for Thermally-Constrained Many-Core Processors. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Rapp, Martin – PersonEntity: Name: NameFull: Sikal, Mohammed Bakr – PersonEntity: Name: NameFull: Khdr, Heba – PersonEntity: Name: NameFull: Henkel, Jörg IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Text: 2021 Type: published Y: 2021 Identifiers: – Type: issn-print Value: 0738100X Numbering: – Type: issue Value: 58 Titles: – TitleFull: DAC: Annual ACM/IEEE Design Automation Conference Type: main |
| ResultId | 1 |