APA (7th ed.) Citation

Liu, J., Mao, H., Yan, M., Huang, S., Li, M., Ding, Z., . . . Li, C. (2026). Sintering kinetics of silver joints: A semi-quantitative approach to predicting temperature-time sintering profiles. Journal of Materials Science: Materials in Electronics, 37(15), 1. https://doi.org/10.1007/s10854-026-17591-4

Chicago Style (17th ed.) Citation

Liu, Jingwen, Huaming Mao, Maoyin Yan, Shijun Huang, Mulan Li, Zifeng Ding, Hongwei Yang, and Cai-Fu Li. "Sintering Kinetics of Silver Joints: A Semi-quantitative Approach to Predicting Temperature-time Sintering Profiles." Journal of Materials Science: Materials in Electronics 37, no. 15 (2026): 1. https://doi.org/10.1007/s10854-026-17591-4.

MLA (9th ed.) Citation

Liu, Jingwen, et al. "Sintering Kinetics of Silver Joints: A Semi-quantitative Approach to Predicting Temperature-time Sintering Profiles." Journal of Materials Science: Materials in Electronics, vol. 37, no. 15, 2026, p. 1, https://doi.org/10.1007/s10854-026-17591-4.