Sintering kinetics of silver joints: a semi-quantitative approach to predicting temperature-time sintering profiles.
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| Title: | Sintering kinetics of silver joints: a semi-quantitative approach to predicting temperature-time sintering profiles. |
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| Authors: | Liu, Jingwen1, Mao, Huaming2, Yan, Maoyin2, Huang, Shijun1, Li, Mulan1, Ding, Zifeng1, Yang, Hongwei2, nanolab@ipm.com.cn, Li, Cai-Fu1, licaifu@mail.sysu.edu.cn |
| Source: | Journal of Materials Science: Materials in Electronics; May2026, Vol. 37 Issue 15, p1-17, 17p |
| Database: | Applied Science & Technology Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 194071271 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Sintering kinetics of silver joints: a semi-quantitative approach to predicting temperature-time sintering profiles. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Liu%2C+Jingwen%22">Liu, Jingwen</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Mao%2C+Huaming%22">Mao, Huaming</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yan%2C+Maoyin%22">Yan, Maoyin</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Huang%2C+Shijun%22">Huang, Shijun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Mulan%22">Li, Mulan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ding%2C+Zifeng%22">Ding, Zifeng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Hongwei%22">Yang, Hongwei</searchLink><relatesTo>2</relatesTo>, <i>nanolab@ipm.com.cn</i><br /><searchLink fieldCode="AU" term="%22Li%2C+Cai-Fu%22">Li, Cai-Fu</searchLink><relatesTo>1</relatesTo>, <i>licaifu@mail.sysu.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; May2026, Vol. 37 Issue 15, p1-17, 17p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=194071271 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10854-026-17591-4 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 17 StartPage: 1 Titles: – TitleFull: Sintering kinetics of silver joints: a semi-quantitative approach to predicting temperature-time sintering profiles. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Liu, Jingwen – PersonEntity: Name: NameFull: Mao, Huaming – PersonEntity: Name: NameFull: Yan, Maoyin – PersonEntity: Name: NameFull: Huang, Shijun – PersonEntity: Name: NameFull: Li, Mulan – PersonEntity: Name: NameFull: Ding, Zifeng – PersonEntity: Name: NameFull: Yang, Hongwei – PersonEntity: Name: NameFull: Li, Cai-Fu IsPartOfRelationships: – BibEntity: Dates: – D: 21 M: 05 Text: May2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 09574522 Numbering: – Type: volume Value: 37 – Type: issue Value: 15 Titles: – TitleFull: Journal of Materials Science: Materials in Electronics Type: main |
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