APA (7th ed.) Citation

Hu, M., Yu, W., Wu, Q., Li, X., Liu, Y., Zhang, H., . . . Su, B. (2026). The Effect of Different Laser Processing Parameters on the Microstructure and Properties of Copper Conductor Joints. Coatings (2079-6412), 16(5), 591. https://doi.org/10.3390/coatings16050591

Chicago Style (17th ed.) Citation

Hu, Ming, Wenqian Yu, Qiong Wu, Xinyu Li, Yu Liu, Hongliang Zhang, Lihong Su, and Boyong Su. "The Effect of Different Laser Processing Parameters on the Microstructure and Properties of Copper Conductor Joints." Coatings (2079-6412) 16, no. 5 (2026): 591. https://doi.org/10.3390/coatings16050591.

MLA (9th ed.) Citation

Hu, Ming, et al. "The Effect of Different Laser Processing Parameters on the Microstructure and Properties of Copper Conductor Joints." Coatings (2079-6412), vol. 16, no. 5, 2026, p. 591, https://doi.org/10.3390/coatings16050591.