An Area-Efficient High-Throughput Hybrid Interconnection Network for Single-Chip Parallel Processing.

Saved in:
Bibliographic Details
Title: An Area-Efficient High-Throughput Hybrid Interconnection Network for Single-Chip Parallel Processing.
Authors: Balkan, Aydin O.1, balkanay@umd.edu, Gang Qu1, gangqu@umd.edu, Vishkin, Uzi1, vishkin@umd.edu
Source: DAC: Annual ACM/IEEE Design Automation Conference; 2008, p435-440, 6p, 4 Diagrams, 1 Chart, 3 Graphs
Database: Applied Science & Technology Source
Be the first to leave a comment!
You must be logged in first