Adhesion improvement of copper/epoxy joints.
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| Title: | Adhesion improvement of copper/epoxy joints. |
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| Authors: | Yun, H. K., Cho, K., An, J. H. |
| Source: | Journal of Materials Science; November 1 1992, Vol. 27, p5811-5817, 7p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00222461 |
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| DOI: | 10.1007/BF01119743 |
