APA (7th ed.) Citation

Shi, Y. Q., & Zhang, X. M. (2002). A New Two-Dimensional Interleaving Technique Using Successive Packing. IEEE Transactions on Circuits & Systems. Part I: Regular Papers, 49(6), 779.

Chicago Style (17th ed.) Citation

Shi, Yun Q., and Xi Min Zhang. "A New Two-Dimensional Interleaving Technique Using Successive Packing." IEEE Transactions on Circuits & Systems. Part I: Regular Papers 49, no. 6 (2002): 779.

MLA (9th ed.) Citation

Shi, Yun Q., and Xi Min Zhang. "A New Two-Dimensional Interleaving Technique Using Successive Packing." IEEE Transactions on Circuits & Systems. Part I: Regular Papers, vol. 49, no. 6, 2002, p. 779.