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A New Two-Dimensional Interleaving Technique Using Successive Packing.

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Bibliographic Details
Title: A New Two-Dimensional Interleaving Technique Using Successive Packing.
Authors: Shi, Yun Q., Zhang, Xi Min
Source: IEEE Transactions on Circuits & Systems. Part I: Regular Papers; June 2002, Vol. 49 Issue 6, p779-789, 11p
Database: Applied Science & Technology Source
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