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Temperature dependence of anelastic properties in Sn-Ag-Cu system and Sn-3.5Ag alloys of lead-free solders.

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Title: Temperature dependence of anelastic properties in Sn-Ag-Cu system and Sn-3.5Ag alloys of lead-free solders.
Authors: Nakamura, Y., Ono, T.
Source: Journal of Materials Science; Jun2005, Vol. 40 Issue 12, p3267-3269, 3p
Database: Applied Science & Technology Source
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PubType: Academic Journal
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  Data: Temperature dependence of anelastic properties in Sn-Ag-Cu system and Sn-3.5Ag alloys of lead-free solders.
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        Value: 10.1007/s10853-005-2698-9
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        Text: English
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      – TitleFull: Temperature dependence of anelastic properties in Sn-Ag-Cu system and Sn-3.5Ag alloys of lead-free solders.
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              Text: Jun2005
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              Y: 2005
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