Temperature dependence of anelastic properties in Sn-Ag-Cu system and Sn-3.5Ag alloys of lead-free solders.
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| Title: | Temperature dependence of anelastic properties in Sn-Ag-Cu system and Sn-3.5Ag alloys of lead-free solders. |
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| Authors: | Nakamura, Y., Ono, T. |
| Source: | Journal of Materials Science; Jun2005, Vol. 40 Issue 12, p3267-3269, 3p |
| Database: | Applied Science & Technology Source |
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