APA (7th ed.) Citation

Hwang, J. W., Yim, M. J., & Paik, K. W. (2005). Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly. Journal of Electronic Materials, 34(11), 1455. https://doi.org/10.1007/s11664-005-0205-3

Chicago Style (17th ed.) Citation

Hwang, J. W., M. J. Yim, and K. W. Paik. "Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly." Journal of Electronic Materials 34, no. 11 (2005): 1455. https://doi.org/10.1007/s11664-005-0205-3.

MLA (9th ed.) Citation

Hwang, J. W., et al. "Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly." Journal of Electronic Materials, vol. 34, no. 11, 2005, p. 1455, https://doi.org/10.1007/s11664-005-0205-3.