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Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly.

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Title: Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly.
Authors: Hwang, J. W., Yim, M. J., Paik, K. W.
Source: Journal of Electronic Materials; November 2005, Vol. 34 Issue 11, p1455-1461, 7p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501163533
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly.
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  Data: <searchLink fieldCode="AU" term="%22Hwang%2C+J%2E+W%2E%22">Hwang, J. W.</searchLink><br /><searchLink fieldCode="AU" term="%22Yim%2C+M%2E+J%2E%22">Yim, M. J.</searchLink><br /><searchLink fieldCode="AU" term="%22Paik%2C+K%2E+W%2E%22">Paik, K. W.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; November 2005, Vol. 34 Issue 11, p1455-1461, 7p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501163533
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-005-0205-3
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      – Code: eng
        Text: English
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        PageCount: 7
        StartPage: 1455
    Titles:
      – TitleFull: Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly.
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            NameFull: Hwang, J. W.
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            NameFull: Yim, M. J.
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            NameFull: Paik, K. W.
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              M: 11
              Text: November 2005
              Type: published
              Y: 2005
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              Value: 34
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              Value: 11
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