Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly.
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| Title: | Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly. |
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| Authors: | Hwang, J. W., Yim, M. J., Paik, K. W. |
| Source: | Journal of Electronic Materials; November 2005, Vol. 34 Issue 11, p1455-1461, 7p |
| Database: | Applied Science & Technology Source |
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