Hwang, J. S., Yim, M. J., & Paik, K. W. (2006). Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates. Journal of Electronic Materials, 35(9), 1722. https://doi.org/10.1007/s11664-006-0225-7
Chicago Style (17th ed.) CitationHwang, J. S., M. J. Yim, and K. W. Paik. "Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates." Journal of Electronic Materials 35, no. 9 (2006): 1722. https://doi.org/10.1007/s11664-006-0225-7.
MLA (9th ed.) CitationHwang, J. S., et al. "Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates." Journal of Electronic Materials, vol. 35, no. 9, 2006, p. 1722, https://doi.org/10.1007/s11664-006-0225-7.