Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates.

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Title: Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates.
Authors: Hwang, J. S., Yim, M. J., Paik, K. W.
Source: Journal of Electronic Materials; September 2006, Vol. 35 Issue 9, p1722-1727, 6p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501307503
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; September 2006, Vol. 35 Issue 9, p1722-1727, 6p
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      – Type: doi
        Value: 10.1007/s11664-006-0225-7
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 1722
    Titles:
      – TitleFull: Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates.
        Type: main
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            NameFull: Hwang, J. S.
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            NameFull: Yim, M. J.
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            NameFull: Paik, K. W.
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            – D: 01
              M: 09
              Text: September 2006
              Type: published
              Y: 2006
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              Value: 35
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              Value: 9
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            – TitleFull: Journal of Electronic Materials
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