Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates.
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| Title: | Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates. |
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| Authors: | Hwang, J. S., Yim, M. J., Paik, K. W. |
| Source: | Journal of Electronic Materials; September 2006, Vol. 35 Issue 9, p1722-1727, 6p |
| Database: | Applied Science & Technology Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 501307503 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Hwang%2C+J%2E+S%2E%22">Hwang, J. S.</searchLink><br /><searchLink fieldCode="AU" term="%22Yim%2C+M%2E+J%2E%22">Yim, M. J.</searchLink><br /><searchLink fieldCode="AU" term="%22Paik%2C+K%2E+W%2E%22">Paik, K. W.</searchLink> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; September 2006, Vol. 35 Issue 9, p1722-1727, 6p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501307503 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11664-006-0225-7 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 1722 Titles: – TitleFull: Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Hwang, J. S. – PersonEntity: Name: NameFull: Yim, M. J. – PersonEntity: Name: NameFull: Paik, K. W. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 09 Text: September 2006 Type: published Y: 2006 Identifiers: – Type: issn-print Value: 03615235 Numbering: – Type: volume Value: 35 – Type: issue Value: 9 Titles: – TitleFull: Journal of Electronic Materials Type: main |
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