APA (7th ed.) Citation

Chung, C. C., & Allen, M. G. (2006). Thermomigration-Based Junction Isolation of Bulk Silicon MEMS Devices. Journal of Microelectromechanical Systems, 15(5), 1131. https://doi.org/10.1109/JMEMS.2005.879685

Chicago Style (17th ed.) Citation

Chung, Charles C., and Mark G. Allen. "Thermomigration-Based Junction Isolation of Bulk Silicon MEMS Devices." Journal of Microelectromechanical Systems 15, no. 5 (2006): 1131. https://doi.org/10.1109/JMEMS.2005.879685.

MLA (9th ed.) Citation

Chung, Charles C., and Mark G. Allen. "Thermomigration-Based Junction Isolation of Bulk Silicon MEMS Devices." Journal of Microelectromechanical Systems, vol. 15, no. 5, 2006, p. 1131, https://doi.org/10.1109/JMEMS.2005.879685.