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Thermomigration-Based Junction Isolation of Bulk Silicon MEMS Devices.

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Bibliographic Details
Title: Thermomigration-Based Junction Isolation of Bulk Silicon MEMS Devices.
Authors: Chung, Charles C., Allen, Mark G.
Source: Journal of Microelectromechanical Systems; October 2006, Vol. 15 Issue 5, p1131-1138, 8p
Database: Applied Science & Technology Source
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