APA (7th ed.) Citation

Zimprich, P., Saeed, U., & Weiss, B. (2009). Constraining Effects of Lead-Free Solder Joints During Stress Relaxation. Journal of Electronic Materials, 38(3), 392. https://doi.org/10.1007/s11664-008-0604-3

Chicago Style (17th ed.) Citation

Zimprich, Peter, Usman Saeed, and Brigitte Weiss. "Constraining Effects of Lead-Free Solder Joints During Stress Relaxation." Journal of Electronic Materials 38, no. 3 (2009): 392. https://doi.org/10.1007/s11664-008-0604-3.

MLA (9th ed.) Citation

Zimprich, Peter, et al. "Constraining Effects of Lead-Free Solder Joints During Stress Relaxation." Journal of Electronic Materials, vol. 38, no. 3, 2009, p. 392, https://doi.org/10.1007/s11664-008-0604-3.