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The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples.

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Title: The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples.
Authors: Wu, W. H., Chung, H. L., Chen, C. N.
Source: Journal of Electronic Materials; December 2009, Vol. 38 Issue 12, p2563-2572, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501530164
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; December 2009, Vol. 38 Issue 12, p2563-2572, 10p
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      – Type: doi
        Value: 10.1007/s11664-009-0876-2
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      – Code: eng
        Text: English
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        PageCount: 10
        StartPage: 2563
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      – TitleFull: The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples.
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            NameFull: Wu, W. H.
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            NameFull: Chung, H. L.
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            NameFull: Chen, C. N.
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              Text: December 2009
              Type: published
              Y: 2009
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