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Extremely High Saturation Current-Bandwidth Product Performance of a Near-Ballistic Uni-Traveling-Carrier Photodiode With a Flip-Chip Bonding Structure.

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Title: Extremely High Saturation Current-Bandwidth Product Performance of a Near-Ballistic Uni-Traveling-Carrier Photodiode With a Flip-Chip Bonding Structure.
Authors: Shi, Jin-Wei, Kuo, F.-M., Wu, C.-J.
Source: IEEE Journal of Quantum Electronics; Feb2010, Vol. 46 Issue 1/2, p80-86, 7p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501547755
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Extremely High Saturation Current-Bandwidth Product Performance of a Near-Ballistic Uni-Traveling-Carrier Photodiode With a Flip-Chip Bonding Structure.
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  Data: <searchLink fieldCode="AU" term="%22Shi%2C+Jin-Wei%22">Shi, Jin-Wei</searchLink><br /><searchLink fieldCode="AU" term="%22Kuo%2C+F%2E-M%2E%22">Kuo, F.-M.</searchLink><br /><searchLink fieldCode="AU" term="%22Wu%2C+C%2E-J%2E%22">Wu, C.-J.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Journal+of+Quantum+Electronics%22">IEEE Journal of Quantum Electronics</searchLink>; Feb2010, Vol. 46 Issue 1/2, p80-86, 7p
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1109/JQE.2009.2027339
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 7
        StartPage: 80
    Titles:
      – TitleFull: Extremely High Saturation Current-Bandwidth Product Performance of a Near-Ballistic Uni-Traveling-Carrier Photodiode With a Flip-Chip Bonding Structure.
        Type: main
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          Name:
            NameFull: Shi, Jin-Wei
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            NameFull: Kuo, F.-M.
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            NameFull: Wu, C.-J.
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              Text: Feb2010
              Type: published
              Y: 2010
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              Value: 46
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              Value: 1/2
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            – TitleFull: IEEE Journal of Quantum Electronics
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