APA (7th ed.) Citation

Morisada, Y., Nagaoka, T., & Fukusumi, M. (2010). A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles. Journal of Electronic Materials, 39(8), 1283. https://doi.org/10.1007/s11664-010-1195-3

Chicago Style (17th ed.) Citation

Morisada, Y., T. Nagaoka, and M. Fukusumi. "A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles." Journal of Electronic Materials 39, no. 8 (2010): 1283. https://doi.org/10.1007/s11664-010-1195-3.

MLA (9th ed.) Citation

Morisada, Y., et al. "A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles." Journal of Electronic Materials, vol. 39, no. 8, 2010, p. 1283, https://doi.org/10.1007/s11664-010-1195-3.