View in EDS PDF Full Text

A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles.

Saved in:
Bibliographic Details
Title: A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles.
Authors: Morisada, Y., Nagaoka, T., Fukusumi, M.
Source: Journal of Electronic Materials; August 2010, Vol. 39 Issue 8, p1283-1288, 6p
Database: Applied Science & Technology Source
Description
ISSN:03615235
DOI:10.1007/s11664-010-1195-3