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A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles.

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Title: A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles.
Authors: Morisada, Y., Nagaoka, T., Fukusumi, M.
Source: Journal of Electronic Materials; August 2010, Vol. 39 Issue 8, p1283-1288, 6p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
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PubType: Academic Journal
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  Data: A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; August 2010, Vol. 39 Issue 8, p1283-1288, 6p
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        Value: 10.1007/s11664-010-1195-3
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 1283
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      – TitleFull: A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles.
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            NameFull: Morisada, Y.
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              Text: August 2010
              Type: published
              Y: 2010
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