A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles.
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| Title: | A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles. |
|---|---|
| Authors: | Morisada, Y., Nagaoka, T., Fukusumi, M. |
| Source: | Journal of Electronic Materials; August 2010, Vol. 39 Issue 8, p1283-1288, 6p |
| Database: | Applied Science & Technology Source |
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