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Outlook for adhesives in electronics.

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Bibliographic Details
Title: Outlook for adhesives in electronics.
Authors: Hess, E. F.
Source: Electronic Industries.; June 1963, Vol. 22, pG10-G13, 4p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 516114924
AccessLevel: 2
PubType: Periodical
PubTypeId: serialPeriodical
PreciseRelevancyScore: 0
IllustrationInfo
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  Data: <searchLink fieldCode="JN" term="%22Electronic+Industries%2E%22">Electronic Industries.</searchLink>; June 1963, Vol. 22, pG10-G13, 4p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=516114924
RecordInfo BibRecord:
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    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
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        PageCount: 4
        StartPage: G10
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      – TitleFull: Outlook for adhesives in electronics.
        Type: main
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          Name:
            NameFull: Hess, E. F.
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          Dates:
            – D: 02
              M: 06
              Text: June 1963
              Type: published
              Y: 1963
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              Value: 0884481X
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              Value: 22
          Titles:
            – TitleFull: Electronic Industries.
              Type: main
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