Friedman, M. Y., & Lenz, E. (1973). Analysis of temperature field in chip. Journal of Engineering for Industry, 95, 317.
Chicago Style (17th ed.) CitationFriedman, M. Y., and E. Lenz. "Analysis of Temperature Field in Chip." Journal of Engineering for Industry 95 (1973): 317.
MLA (9th ed.) CitationFriedman, M. Y., and E. Lenz. "Analysis of Temperature Field in Chip." Journal of Engineering for Industry, vol. 95, 1973, p. 317.
Warning: These citations may not always be 100% accurate.