Analysis of temperature field in chip.

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Bibliographic Details
Title: Analysis of temperature field in chip.
Authors: Friedman, M. Y., Lenz, E.
Source: Journal of Engineering for Industry; February 1973, Vol. 95, p317-320, 4p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 516616380
AccessLevel: 2
PubType: Periodical
PubTypeId: serialPeriodical
PreciseRelevancyScore: 0
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  Data: Analysis of temperature field in chip.
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  Data: <searchLink fieldCode="AU" term="%22Friedman%2C+M%2E+Y%2E%22">Friedman, M. Y.</searchLink><br /><searchLink fieldCode="AU" term="%22Lenz%2C+E%2E%22">Lenz, E.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Engineering+for+Industry%22">Journal of Engineering for Industry</searchLink>; February 1973, Vol. 95, p317-320, 4p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=516616380
RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 4
        StartPage: 317
    Titles:
      – TitleFull: Analysis of temperature field in chip.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Friedman, M. Y.
      – PersonEntity:
          Name:
            NameFull: Lenz, E.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 02
              Text: February 1973
              Type: published
              Y: 1973
          Identifiers:
            – Type: issn-print
              Value: 00220817
          Numbering:
            – Type: volume
              Value: 95
          Titles:
            – TitleFull: Journal of Engineering for Industry
              Type: main
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