APA (7th ed.) Citation

Morisada, Y., Nagaoka, T., Fukusumi, M., Kashiwagi, Y., Yamamoto, M., Nakamoto, M., . . . Yoshida, Y. (2011). A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles. Journal of Electronic Materials, 40(12), 2398. https://doi.org/10.1007/s11664-011-1750-6

Chicago Style (17th ed.) Citation

Morisada, Y., T. Nagaoka, M. Fukusumi, Y. Kashiwagi, M. Yamamoto, M. Nakamoto, H. Kakiuchi, and Y. Yoshida. "A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles." Journal of Electronic Materials 40, no. 12 (2011): 2398. https://doi.org/10.1007/s11664-011-1750-6.

MLA (9th ed.) Citation

Morisada, Y., et al. "A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles." Journal of Electronic Materials, vol. 40, no. 12, 2011, p. 2398, https://doi.org/10.1007/s11664-011-1750-6.