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A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles.

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Title: A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles.
Authors: Morisada, Y.1, morisada@jwri.osaka-u.ac.jp, Nagaoka, T.1, Fukusumi, M.1, Kashiwagi, Y.1, Yamamoto, M.1, Nakamoto, M.1, Kakiuchi, H.2, Yoshida, Y.2
Source: Journal of Electronic Materials; Dec2011, Vol. 40 Issue 12, p2398-2402, 5p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 66903700
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Morisada%2C+Y%2E%22">Morisada, Y.</searchLink><relatesTo>1</relatesTo>, <i>morisada@jwri.osaka-u.ac.jp</i><br /><searchLink fieldCode="AU" term="%22Nagaoka%2C+T%2E%22">Nagaoka, T.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Fukusumi%2C+M%2E%22">Fukusumi, M.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Kashiwagi%2C+Y%2E%22">Kashiwagi, Y.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yamamoto%2C+M%2E%22">Yamamoto, M.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Nakamoto%2C+M%2E%22">Nakamoto, M.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Kakiuchi%2C+H%2E%22">Kakiuchi, H.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yoshida%2C+Y%2E%22">Yoshida, Y.</searchLink><relatesTo>2</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Dec2011, Vol. 40 Issue 12, p2398-2402, 5p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=66903700
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-011-1750-6
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 5
        StartPage: 2398
    Titles:
      – TitleFull: A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Morisada, Y.
      – PersonEntity:
          Name:
            NameFull: Nagaoka, T.
      – PersonEntity:
          Name:
            NameFull: Fukusumi, M.
      – PersonEntity:
          Name:
            NameFull: Kashiwagi, Y.
      – PersonEntity:
          Name:
            NameFull: Yamamoto, M.
      – PersonEntity:
          Name:
            NameFull: Nakamoto, M.
      – PersonEntity:
          Name:
            NameFull: Kakiuchi, H.
      – PersonEntity:
          Name:
            NameFull: Yoshida, Y.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 12
              Text: Dec2011
              Type: published
              Y: 2011
          Identifiers:
            – Type: issn-print
              Value: 03615235
          Numbering:
            – Type: volume
              Value: 40
            – Type: issue
              Value: 12
          Titles:
            – TitleFull: Journal of Electronic Materials
              Type: main
ResultId 1