A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles.
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| Title: | A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles. |
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| Authors: | Morisada, Y.1, morisada@jwri.osaka-u.ac.jp, Nagaoka, T.1, Fukusumi, M.1, Kashiwagi, Y.1, Yamamoto, M.1, Nakamoto, M.1, Kakiuchi, H.2, Yoshida, Y.2 |
| Source: | Journal of Electronic Materials; Dec2011, Vol. 40 Issue 12, p2398-2402, 5p |
| Database: | Applied Science & Technology Source |
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