Pratama, A., Wijayanto, E. D., Hendrawan, Y. M., Harja, H. B., Rasyid, M. U. H. A., & Winarno, I. (2023). Hole feature recognition from 3D solid model for CAIP application. AIP Conference Proceedings, 2665(1), 1. https://doi.org/10.1063/5.0127615
Chicago Style (17th ed.) CitationPratama, Andri, Edo Dwi Wijayanto, Yogi Muldani Hendrawan, Herman Budi Harja, M. Udin Harun Al Rasyid, and Idris Winarno. "Hole Feature Recognition from 3D Solid Model for CAIP Application." AIP Conference Proceedings 2665, no. 1 (2023): 1. https://doi.org/10.1063/5.0127615.
MLA (9th ed.) CitationPratama, Andri, et al. "Hole Feature Recognition from 3D Solid Model for CAIP Application." AIP Conference Proceedings, vol. 2665, no. 1, 2023, p. 1, https://doi.org/10.1063/5.0127615.