APA (7th ed.) Citation

Tupciauskas, R., Orlovskis, Z., Blums, K. T., Liepins, J., Berzins, A., Pavlovics, G., & Andzs, M. (2024). Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed. Polymers (20734360), 16(4), 562. https://doi.org/10.3390/polym16040562

Chicago Style (17th ed.) Citation

Tupciauskas, Ramunas, Zigmunds Orlovskis, Karlis Trevors Blums, Janis Liepins, Andris Berzins, Gunars Pavlovics, and Martins Andzs. "Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed." Polymers (20734360) 16, no. 4 (2024): 562. https://doi.org/10.3390/polym16040562.

MLA (9th ed.) Citation

Tupciauskas, Ramunas, et al. "Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed." Polymers (20734360), vol. 16, no. 4, 2024, p. 562, https://doi.org/10.3390/polym16040562.