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Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed.

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Title: Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed.
Authors: Tupciauskas, Ramunas1 (AUTHOR) andris.berzins@kki.lv, Orlovskis, Zigmunds2,3 (AUTHOR) zigmunds.orlovskis@lu.lv, Blums, Karlis Trevors2,3 (AUTHOR) ktblums@gmail.com, Liepins, Janis2 (AUTHOR) janis.liepins@lu.lv, Berzins, Andris1,4 (AUTHOR) pavlovichs@inbox.lv, Pavlovics, Gunars1 (AUTHOR) martins.andzs@kki.lv, Andzs, Martins1 (AUTHOR)
Source: Polymers (20734360). Feb2024, Vol. 16 Issue 4, p562. 13p.
Database: Academic Search Ultimate
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  Data: Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed.
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  Data: <searchLink fieldCode="JN" term="%22Polymers+%2820734360%29%22">Polymers (20734360)</searchLink>. Feb2024, Vol. 16 Issue 4, p562. 13p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=175651671
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        Value: 10.3390/polym16040562
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        Text: English
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      – TitleFull: Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed.
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              Text: Feb2024
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