Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed. - Tupciauskas, Ramunas; Orlovskis, Zigmunds; Blums, Karlis Trevors; Liepins, Janis; Berzins, Andris; Pavlovics, Gunars; Andzs, Martins (Polymers (20734360), 2024)