Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB). - Han, Sang-Eun; Choi, Dong-Gyu; Han, Seonghui; Lee, Tae-Young; Han, Deok-Gon; Lee, Hoo-Jeong; Yoo, Sehoon (Materials (1996-1944), 2025)