Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips. - Zhang, Zheng; Zhang, Yanlin; Luo, Yuanyuan; Lv, Guoliang; Yin, Jianglin; Tan, Pengwei; Duan, Guotao (Nano-Micro Letters, 2026)