Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials.
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| Title: | Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials. |
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| Authors: | Li, Zhen1 (AUTHOR), Han, Zhiyun1,2 (AUTHOR), Zhang, Xinkai1,3 (AUTHOR), Xu, Yizhou1 (AUTHOR), Zou, Liang1,2 (AUTHOR) zouliang@sdu.edu.cn, Huang, Kejie2,3 (AUTHOR), Ren, Hanwen3 (AUTHOR) |
| Source: | Polymers (20734360). May2026, Vol. 18 Issue 10, p1232. 16p. |
| Database: | Academic Search Ultimate |
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