Uniformity study of wafer-scale InP-to-silicon hybrid integration.
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| Title: | Uniformity study of wafer-scale InP-to-silicon hybrid integration. |
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| Authors: | Liang, Di1 dliang@ece.ucsb.edu, Chapman, David2 chapman@ll.mit.edu, Li, Youli3 youli@mrl.ucsb.edu, Oakley, Douglas2 Oakley@ll.mit.edu, Napoleone, Tony2 napoleone@ll.mit.edu, Juodawlkis, Paul2, Brubaker, Chad4 c.brubaker@evgroup.com, Mann, Carl4 c.mann@evgroup.com, Bar, Hanan5 hanan.bar@intel.com, Raday, Omri5 omri.raday@intel.com, Bowers, John1 bowers@ece.ucsb.edu |
| Source: | Applied Physics A: Materials Science & Processing. Apr2011, Vol. 103 Issue 1, p213-218. 6p. 1 Color Photograph, 2 Black and White Photographs, 2 Diagrams. |
| Database: | Academic Search Ultimate |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: asn DbLabel: Academic Search Ultimate An: 59524326 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Uniformity study of wafer-scale InP-to-silicon hybrid integration. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Liang%2C+Di%22">Liang, Di</searchLink><relatesTo>1</relatesTo><i> dliang@ece.ucsb.edu</i><br /><searchLink fieldCode="AR" term="%22Chapman%2C+David%22">Chapman, David</searchLink><relatesTo>2</relatesTo><i> chapman@ll.mit.edu</i><br /><searchLink fieldCode="AR" term="%22Li%2C+Youli%22">Li, Youli</searchLink><relatesTo>3</relatesTo><i> youli@mrl.ucsb.edu</i><br /><searchLink fieldCode="AR" term="%22Oakley%2C+Douglas%22">Oakley, Douglas</searchLink><relatesTo>2</relatesTo><i> Oakley@ll.mit.edu</i><br /><searchLink fieldCode="AR" term="%22Napoleone%2C+Tony%22">Napoleone, Tony</searchLink><relatesTo>2</relatesTo><i> napoleone@ll.mit.edu</i><br /><searchLink fieldCode="AR" term="%22Juodawlkis%2C+Paul%22">Juodawlkis, Paul</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Brubaker%2C+Chad%22">Brubaker, Chad</searchLink><relatesTo>4</relatesTo><i> c.brubaker@evgroup.com</i><br /><searchLink fieldCode="AR" term="%22Mann%2C+Carl%22">Mann, Carl</searchLink><relatesTo>4</relatesTo><i> c.mann@evgroup.com</i><br /><searchLink fieldCode="AR" term="%22Bar%2C+Hanan%22">Bar, Hanan</searchLink><relatesTo>5</relatesTo><i> hanan.bar@intel.com</i><br /><searchLink fieldCode="AR" term="%22Raday%2C+Omri%22">Raday, Omri</searchLink><relatesTo>5</relatesTo><i> omri.raday@intel.com</i><br /><searchLink fieldCode="AR" term="%22Bowers%2C+John%22">Bowers, John</searchLink><relatesTo>1</relatesTo><i> bowers@ece.ucsb.edu</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Applied+Physics+A%3A+Materials+Science+%26+Processing%22">Applied Physics A: Materials Science & Processing</searchLink>. Apr2011, Vol. 103 Issue 1, p213-218. 6p. 1 Color Photograph, 2 Black and White Photographs, 2 Diagrams. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=59524326 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s00339-010-5999-z Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 213 Titles: – TitleFull: Uniformity study of wafer-scale InP-to-silicon hybrid integration. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Liang, Di – PersonEntity: Name: NameFull: Chapman, David – PersonEntity: Name: NameFull: Li, Youli – PersonEntity: Name: NameFull: Oakley, Douglas – PersonEntity: Name: NameFull: Napoleone, Tony – PersonEntity: Name: NameFull: Juodawlkis, Paul – PersonEntity: Name: NameFull: Brubaker, Chad – PersonEntity: Name: NameFull: Mann, Carl – PersonEntity: Name: NameFull: Bar, Hanan – PersonEntity: Name: NameFull: Raday, Omri – PersonEntity: Name: NameFull: Bowers, John IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 04 Text: Apr2011 Type: published Y: 2011 Identifiers: – Type: issn-print Value: 09478396 Numbering: – Type: volume Value: 103 – Type: issue Value: 1 Titles: – TitleFull: Applied Physics A: Materials Science & Processing Type: main |
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