Uniformity study of wafer-scale InP-to-silicon hybrid integration. - Liang, Di; Chapman, David; Li, Youli; Oakley, Douglas; Napoleone, Tony; Juodawlkis, Paul; Brubaker, Chad; Mann, Carl; Bar, Hanan; Raday, Omri; Bowers, John (Applied Physics A: Materials Science & Processing, 2011)