Uniformity study of wafer-scale InP-to-silicon hybrid integration.
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| Title: | Uniformity study of wafer-scale InP-to-silicon hybrid integration. |
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| Authors: | Liang, Di1 dliang@ece.ucsb.edu, Chapman, David2 chapman@ll.mit.edu, Li, Youli3 youli@mrl.ucsb.edu, Oakley, Douglas2 Oakley@ll.mit.edu, Napoleone, Tony2 napoleone@ll.mit.edu, Juodawlkis, Paul2, Brubaker, Chad4 c.brubaker@evgroup.com, Mann, Carl4 c.mann@evgroup.com, Bar, Hanan5 hanan.bar@intel.com, Raday, Omri5 omri.raday@intel.com, Bowers, John1 bowers@ece.ucsb.edu |
| Source: | Applied Physics A: Materials Science & Processing. Apr2011, Vol. 103 Issue 1, p213-218. 6p. 1 Color Photograph, 2 Black and White Photographs, 2 Diagrams. |
| Database: | Academic Search Ultimate |
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