APA (7th ed.) Citation

Boettcher, L., Manessis, D., Karaszkiewicz, S., Ostmann, A., & Reichl, H. (2010). Next Generation System in a Package Manufacturing by Embedded Chip Technologies. Journal of Microelectronic & Electronic Packaging, 7(3), 131. https://doi.org/10.4071/imaps.261

Chicago Style (17th ed.) Citation

Boettcher, Lars, D. Manessis, S. Karaszkiewicz, A. Ostmann, and H. Reichl. "Next Generation System in a Package Manufacturing by Embedded Chip Technologies." Journal of Microelectronic & Electronic Packaging 7, no. 3 (2010): 131. https://doi.org/10.4071/imaps.261.

MLA (9th ed.) Citation

Boettcher, Lars, et al. "Next Generation System in a Package Manufacturing by Embedded Chip Technologies." Journal of Microelectronic & Electronic Packaging, vol. 7, no. 3, 2010, p. 131, https://doi.org/10.4071/imaps.261.