Next Generation System in a Package Manufacturing by Embedded Chip Technologies.
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| Title: | Next Generation System in a Package Manufacturing by Embedded Chip Technologies. |
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| Authors: | Boettcher, Lars1 lars.boettcher@izm.fraunhofer.de, Manessis, D.2, Karaszkiewicz, S.2, Ostmann, A.1, Reichl, H.2 |
| Source: | Journal of Microelectronic & Electronic Packaging. 2010 3rd Quarter, Vol. 7 Issue 3, p131-137. 7p. 9 Black and White Photographs, 3 Diagrams. |
| Database: | Academic Search Ultimate |
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