APA (7th ed.) Citation

Daniel, M., Friedemann, M., Jöhrmann, N., Liebig, A., Donges, J., Hietschold, M., . . . Albrecht, M. (2013). Influence of the substrate thermal expansion coefficient on the morphology and elastic stress of CoSb3 thin films. Physica Status Solidi. A: Applications & Materials Science, 210(1), 140. https://doi.org/10.1002/pssa.201228388

Chicago Style (17th ed.) Citation

Daniel, M., M. Friedemann, N. Jöhrmann, A. Liebig, J. Donges, M. Hietschold, G. Beddies, and M. Albrecht. "Influence of the Substrate Thermal Expansion Coefficient on the Morphology and Elastic Stress of CoSb3 Thin Films." Physica Status Solidi. A: Applications & Materials Science 210, no. 1 (2013): 140. https://doi.org/10.1002/pssa.201228388.

MLA (9th ed.) Citation

Daniel, M., et al. "Influence of the Substrate Thermal Expansion Coefficient on the Morphology and Elastic Stress of CoSb3 Thin Films." Physica Status Solidi. A: Applications & Materials Science, vol. 210, no. 1, 2013, p. 140, https://doi.org/10.1002/pssa.201228388.