APA (7th ed.) Citation

Duan, N., Scheer, J., Bielen, J., & van Kleef, M. (2003). The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates. Microelectronics Reliability, 43(8), 1317. https://doi.org/10.1016/S0026-2714(03)00135-5

Chicago Style (17th ed.) Citation

Duan, N., J. Scheer, J. Bielen, and M. van Kleef. "The Influence of Sn–Cu–Ni(Au) and Sn–Au Intermetallic Compounds on the Solder Joint Reliability of Flip Chips on Low Temperature Co-fired Ceramic Substrates." Microelectronics Reliability 43, no. 8 (2003): 1317. https://doi.org/10.1016/S0026-2714(03)00135-5.

MLA (9th ed.) Citation

Duan, N., et al. "The Influence of Sn–Cu–Ni(Au) and Sn–Au Intermetallic Compounds on the Solder Joint Reliability of Flip Chips on Low Temperature Co-fired Ceramic Substrates." Microelectronics Reliability, vol. 43, no. 8, 2003, p. 1317, https://doi.org/10.1016/S0026-2714(03)00135-5.