The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates
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| Title: | The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates |
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| Authors: | Duan, N. ning.duan@philips.com, Scheer, J.1, Bielen, J., van Kleef, M. |
| Source: | Microelectronics Reliability. Aug2003, Vol. 43 Issue 8, p1317. 11p. |
| Subjects: | Intermetallic compounds, Metallurgy |
| Abstract: | The formation of intermetallic compounds in the solder joint of a flip chip or chip scale package depends on the under bump metallurgy (UBM), the substrate top surface metallisation, the solder alloy and the application conditions. To evaluate the influence of intermetallic compounds on the solder joint reliability, a detailed study on the influence of the UBM, the gold finish thickness of the substrate top surface metallisation, the solder alloy and the aging conditions has been conducted. Flip chips bumped with different solder alloys were reflow-mounted on low temperature co-fired ceramic substrates. The flip chip package was then aged at high temperature and a bump shear test followed to examine the shear strength of the solder joint at certain aging intervals. It was found that the type of UBM has a great impact on the solder joint reliability. With Ni(P)/Au as the UBM, well-documented gold embrittlement was observed when the gold concentration in the eutectic SnPb solder was about 3 wt%. When Al/Ni(V)/Cu was used as the UBM, the solder joint reliability was substantially improved. Copper dissolution from the UBM into the solder gives different intermetallic formations compared to Ni(P)/Au as UBM. The addition of a small amount of copper in the solder alloy changed the mechanical property of the intermetallic compound, which is attributed to the formation of Sn–Cu–Ni(Au) intermetallic compounds. This could be used in solving the problem of the AuSn4 embrittlement. The formation and the influence of this Sn–Cu–Ni(Au) intermetallic phase are discussed. The gold concentration in the solder joint plays a role in the formation of intermetallic compounds and consequently the solder joint reliability, especially for the Sn–Ag–Cu soldered flip chip package. [Copyright &y& Elsevier] |
| Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 10364662 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Duan%2C+N%2E%22">Duan, N.</searchLink><i> ning.duan@philips.com</i><br /><searchLink fieldCode="AR" term="%22Scheer%2C+J%2E%22">Scheer, J.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Bielen%2C+J%2E%22">Bielen, J.</searchLink><br /><searchLink fieldCode="AR" term="%22van+Kleef%2C+M%2E%22">van Kleef, M.</searchLink> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>. Aug2003, Vol. 43 Issue 8, p1317. 11p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Metallurgy%22">Metallurgy</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: The formation of intermetallic compounds in the solder joint of a flip chip or chip scale package depends on the under bump metallurgy (UBM), the substrate top surface metallisation, the solder alloy and the application conditions. To evaluate the influence of intermetallic compounds on the solder joint reliability, a detailed study on the influence of the UBM, the gold finish thickness of the substrate top surface metallisation, the solder alloy and the aging conditions has been conducted. Flip chips bumped with different solder alloys were reflow-mounted on low temperature co-fired ceramic substrates. The flip chip package was then aged at high temperature and a bump shear test followed to examine the shear strength of the solder joint at certain aging intervals. It was found that the type of UBM has a great impact on the solder joint reliability. With Ni(P)/Au as the UBM, well-documented gold embrittlement was observed when the gold concentration in the eutectic SnPb solder was about 3 wt%. When Al/Ni(V)/Cu was used as the UBM, the solder joint reliability was substantially improved. Copper dissolution from the UBM into the solder gives different intermetallic formations compared to Ni(P)/Au as UBM. The addition of a small amount of copper in the solder alloy changed the mechanical property of the intermetallic compound, which is attributed to the formation of Sn–Cu–Ni(Au) intermetallic compounds. This could be used in solving the problem of the AuSn4 embrittlement. The formation and the influence of this Sn–Cu–Ni(Au) intermetallic phase are discussed. The gold concentration in the solder joint plays a role in the formation of intermetallic compounds and consequently the solder joint reliability, especially for the Sn–Ag–Cu soldered flip chip package. [Copyright &y& Elsevier] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/S0026-2714(03)00135-5 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 11 StartPage: 1317 Subjects: – SubjectFull: Intermetallic compounds Type: general – SubjectFull: Metallurgy Type: general Titles: – TitleFull: The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Duan, N. – PersonEntity: Name: NameFull: Scheer, J. – PersonEntity: Name: NameFull: Bielen, J. – PersonEntity: Name: NameFull: van Kleef, M. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 08 Text: Aug2003 Type: published Y: 2003 Identifiers: – Type: issn-print Value: 00262714 Numbering: – Type: volume Value: 43 – Type: issue Value: 8 Titles: – TitleFull: Microelectronics Reliability Type: main |
| ResultId | 1 |
